Thermal Study - Cooling for electronic devices

[sta.schaefer]

 

Using the thermal cooling simulation tool, I found that air particle traces pass through a solid aluminum enclosure , modeled around the internal device volume (see cross-section below). As a result, air flow is marginally exiting enclosure through designated venting holes.

Steps tried to fix the problem without success:

• Components intersections were fixed
• Simulation accuracy was set from medium to highest

[sta.schaefer]

 

Using the thermal cooling simulation tool, I found that air particle traces pass through a solid aluminum enclosure , modeled around the internal device volume (see cross-section below). As a result, air flow is marginally exiting enclosure through designated venting holes.

Steps tried to fix the problem without success:

• Components intersections were fixed
• Simulation accuracy was set from medium to highest