Power planes, feature requests

[erik.buerV95QJ]

I route with shapes. Most of my power and large current signals are routed with shapes on my boards. This is to ensure maximum capacitance between signal and return. However the polygon tool is lacking a bit in functionality.

I would like to have:

• Negative shapes
• A shape which works as a negative (boolean NOT) to whichever plane it is placed upon.
• Min distance.
• A tool which finds the shortest distance between two objects, shape-trace, shape-pad etc.. and returns the distance. This is essential in high voltage, and designs with voltage isolation requirements.
• Thermal keepout configuration.
• On multilayer boards it is essential to be able to configure how many thermal relief connections a pin is allowed to have in order to ensure that rework soldering is possible. A setting which allow the selection of which layers the connections are allowed, and amount of connections would be practical. This configuration must be possible on a layer basis (global), shape basis, net basis, and pin basis.
• Dynamic thermals contact.
• When a pad cannot place a set amount of shape connections due to the shape not completely covering the pad, it should create the set amount of connections with equeal angular separation on the available contact area to the shape.
• Display shape edge.
• The shapes edges must be shown even for poured planes in order to reduce the amount of clicks necessary for editing planes.
• Layer and shape opacity
• When working on multilayer boards it is essential to be able to see through multiple layers. A separate layer and shape opacity would be neat.
• Signal color and highlight.
• When routing complex boards, it is necessary to be able to highlight and color specific nets in order to follow them throughout the board. Net coloring should be possible, independent of the layer colors.
• Net-to-shape keepout.
• When routing sensitive analog signals, e.g. controlled impedance traces, the distance to the same layer planes must be configurable. A net-to-shape distance constraint is necessary.
• Plane capacitance calculations.
• A simple way of calculating plane capacitance between signals. This is necessary in power integrity design.
• Non-functional pads (NFP)
• Vias have pads on all layers regardless of whether there are connections or not. These pads add capacitance to the signals, which are unfavorable on sensitive nets. It should be an option to remove NFPs on specified nets and layers.

Eager to see where how Fusion turns out 🙂

[jodom4]

Thank you, erik.buerV95QJ! Could we trouble you to copy / paste the content of this post as a comment on this Feedback Hub post?

https://forums.autodesk.com/t5/fusion-360-feedback-hub/electronics-design-pcb-workspaces-2d-and-3d-s...

This is the best place to get feedback directly to the team that can make things happen.

[jorge_garcia · Accepted solution]

Hi @erik.buerV95QJ,

I hope you're doing well. These are very good suggestions. Just wanted to let you know that the first one is already available. They are called cutout polygons, to use them just draw a normal polygon and then change it's fill style to be cutout and it will work as a negative poly.

Let me know if there's anything else I can do for you.

Best Regards,