Does fusion have a way to create BGA footprints easier? I can't even figure out how to make a pad for a BGA. It only has an option for SMD pads. What's the typical workflow to create a BGA footprint? Circle creates an outline of the ball, but how do I fill it with copper afterwards? I couldn't find anything in the docs.
It's not that hard to create a BGA footprint.
Set your grid to the same as bga pads needs according the specs in the datasheet of your device.
Then place a smd pad, choose before you place the required width and height in the Size window. Because you want round pads both need to be the same. If your required size is not in the list just overwrite one.
Check you datasheet again for the required landpattern (pad size).
Choose roundness 100%.
Click now on the grid, voila pad 1, click again voila pad 2, etc...
Even with 100 pads job is done in not that much time.
Have fun
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