Thermal Contact

[milani]

Dear all,

is possible to create a thermal contact beetween two surface in Nastran with an imposed conductivity?

Best regards

Stefano

[John_Holtz]

Hi Stefano,

The separation contact does include thermal resistance. Nastran uses thermal conductance, defined as the heat flux/temperature gradient.

Check out the field CTC on the contact card, BSCONP.

[milani]

Hi,

I usually use CONTACTGENERATE card.

How can use this type of contact in Nastran? can you share  an example?

Best regards

Stefano

[shigeaki.k · Accepted solution]

Hello @milani,

the definition for CTC, the thermal conductance, for BSCONP is given in the Nastran Help Documentation. Screenshot is shown in Fig.1 for ease of reference. 

I have set up a simple model comprised of two cubes bonded together in Nastran In-CAD. Linear hear transfer analysis was setup up. The material used has thermal conductivity defined (see Fig.2). Heat it applied to the bottom of the lower cube and convection boundary condition is applied to the top of the upper cube. Bonded contact is used with a random value of CTC in BSCONP for demonstration purpose. Result is shown in Fig.3. 

The corresponding *.nas file, BSCONP_CNC_Example.nas, is attached for your reference.

                                         Fig.1

                                          Fig.2 

                                           Fig.3

Regards,

Shigeaki K.

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[shigeaki.k]

@milani,

sorry, the file didn't attach with the previous post. I have reattached the nas file with this comment.

Regards,

Shigeaki K.

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