I was wondering if anyone has had to define a temperature based thermal capacitance model for transient analysis.
I am running a simulation of a melting interface of polyethylene in an electrofusion coupling - PE has a fairly high enthalpy of fusion so I have built a temperature dependent thermal capacitance curve that roughly approximates a DSC curve for the material.
I have had poor success manually mapping the table to the material by editing the MATT4 entry in the Nastran File to point at the defined table. The solution becomes very unstable no matter what mesh density I apply.
The Inventor interface itself only provides the ability to define the table for thermal conductivity.
Has anyone had to do something like this and have any ideas to incorporate this physical behavior?
Best Regards,
JE
