VIAS to Polygons best practice.

[wes55ETD]

Hello, 

I am replicating an old design so a lot of it is imported gerber files.  I am struggling to learn to connect a via from a polygon pour on top and on bottom. The outline will not let me rename to PGND. I can rename the pour after filling to PGND. All vias are PGND.

1)How can I make the pour fill to the outline, with the same signal as the vias?

2) The other issue is that when I do the pour and change the signal to PGND, the polygon seems to cover the via entirely and I still cant update the outline to PGND. Should I allow the polygon to overlap the via? It seems to fill over the hole as well. Is that a manufacturing issue?

3) In their designer there are squares and circles within their pours for where the smd components will mount. Can those be deleted since the area will be covered with a same signal pour?

Thank you for any help.

[jorge_garcia]

Hi @wes55ETD,

I hope you're doing well. It looks like there are is some weird overlap in the polygon outline. That may be contributing to the issue you are seeing here. Use the NAME command and click on the polygon outline, that will let you change the name of just the polygon. Don't try through the inspector.

Let me know if there's anything else I can do for you.

Best Regards,