New user trying to create a round polygon pour

[edneeves]

I am trying to build a custom PCB and the learning curve is quite steep. I am pretty confident in the standard 360, but Electronics is much more difficult for me to get my head around. I have the board built (its a basic board) but I have to create some tracks for a potentiometer wiper to run around and I am struggling to do this.

The board is roughly 40mm x 40mm with a 6mm hole in the middle. I am trying to create a solid ring ground plane in the middle for the ground wiper and a segmented ring on the outside that I can connect to each of my pads on the outside of that (this is a stepped attenuator) with as small a gap between each segment as possible.

I tried to use the board shape circle option to create the outer edges of the rings, but then I couldn't select them to execute the polygon pour. Nor can I figure out how to pour a round polygon.

Loads of googling isn't helping much either. Clearly my limited knowledge is blocking me on these final steps.

I have attached a mock up of what I am trying to do in Fusion 360. I assume if I can create these tracks, I am drop a small pad inside of them that is in my schematic to clink them to the components?

[edneeves]

OK, I kept playing. I managed to figure out after watching the videos how to generate a new component. I basically created a circle for the ground wiper track and have managed to drop it in the schematic and also render a 3D model. I think I have something wrong still as I wasn't able to make it a pad without dropping an actual pad in to it, plus my dimensions are wrong I think as the line thickness I think goes both ways from the radius.

So that leaves me with a question on the circle track I have created (I will endeavour to get to the more complicated one later): How can I turn a circle shape in the device manager in to a pad? Have I done the right thing by putting an SMD pad inside the circle I created or is there another way? It seems there must be a different way vs what I have done. See attached image.