Hi Moldflow Community ,
does anyone know what heat from circuit stands for in the log file? I attached the log of a cool analysis, it is an analysis of a steel insert with conventional cooling circuits. Heat removal over circuit is all together 0.581 kW (2 circuits are included in inserts) according to the log. But there is another line stating that heat from circuit is 0.0778 kW, what does this mean? Furthermore, I assume heat from cavity is the heat introduced by the melt to the cavity and heat from mold exterior is the heat conducted by the mold from the cavtiy, am I right?
BR,
Béla
