In microchip encapsulation module material is epoxy thermoset with core- shift simulation. I need to connect metal insert with wire element.

[pchandrasekar]

Hi team,

To perform core shift analysis for thermoplastic we can select injection molding module , metal insert with part insert properties and To perform core shift we need to check perform core shift option in solver parameter.

But in terms of epoxy material I need to check the deformation of wire.

so I have selected microchip encapsulation module for thermoset material.

In my case I need to get result for wire deformation (wire is connected between two metal frame or insert).

The concern I have is wire is not connected with lead frame or steel insert material.

I have connected the wire with insert or frame node and by checking its connectivity ( there is no connectivity between them).

I have shared some information like epoxy mat, steel to steel insert wire should be connected) and have shared the image.

Correct me if I am in different direction by selecting the module or I have missed something can you guide me.

Thanks.

[mason.myers]

Hello @pchandrasekar ,

Can you try modeling the wire as a 3D CAD body?

Mason

[pchandrasekar]

Hi Mason,

Thanks for the quick reply.

I have tried by creating solid body and tetra element are separated by its layer.

while selecting the 3D body with tetra mesh wire element (properties like-WIRE & LEADFRAME not visible in property panel window)

Refer attachment.

Another point is in mold flow help desk they mentioned wire element should be 1D beam element and if the study file has curve (wire properties) are visible.

Can you guide me to proceed further.
Thanks

[bernor_mf]

@pchandrasekar 

Hi,
just wanted to share.

Modeling the wire for microchip encapsulation analysis
Wire is available for lines/curves, hence 1D element.

Modeling the paddle for Microchip Encapsulation analysis
For a 3D mesh model, select Part insert (3D)

Leadframe, 3D mesh : Part insert (3D)
Wire : lines/curves, hence 1D element.

Did you do this according to modeling guide?
Leadframe, 3D mesh : Part insert (3D)
You must set boundary conditions at points which will be clamped during encapsulation by applying constraints.

Wire : lines/curves, hence 1D element.
Note: You need to specify boundary conditions at the two ends of each wire.
The boundaries should have zero x-, y-, and z-displacements, and zero x-, y-, and z-rotations.

And to set the wished analysis sequence:
Fill + Pack + Paddle Shift + Wire Sweep

Hope this helps somewhat.
Regards,
Berndt

[pchandrasekar]

Hi Berndt,

Thanks for the reply.

I have tried with part insert (3d) for lead frame or I select part insert (3d) for tetra mesh element.

wire 1D element is not connected.

[bernor_mf]

@pchandrasekar 

Hi,

right, and if  sharing node it should show connected.
Did you specify boundary conditions at the two ends of wire?
The boundaries should have zero x-, y-, and z-displacements, and zero x-, y-, and z-rotations.

Regards,

Berndt

[pchandrasekar]

Hi Berndt,

Thanks for the reply.

you are right in my case wire is not connected with part insert or lead frame. refer attachment.

I have set boundary condition too.

If possible can you help by sharing some of the model or image it contain microchip encapsulation study with wire or wire which connects part insert or lead frame. 

This will help to sort out connectivity issues between wire element.
Thanks.

[bernor_mf]

@pchandrasekar 

Hi,

Unfortunately I have no model or image to share in this respect for now.

Following the help instructions should help to resolve.

What does analysis log say when you try the model setup?

@mason.myers 

Mason, could you help in this matter?

Do you have paddle shift model to share?

Thanks.

Regards,

Berndt

[pchandrasekar]

Hi @bernor_mf

I have followed Autodesk help document but connectivity issue is not sort out.

Reg log file - I think usually our best practice is to check the connectivity before starting simulation so I didn't moved to simulation phase.

@mason.myers It will be help full if the microchip encapsulation document has wire element.

Thanks.

[mason.myers]

Hello @pchandrasekar ,

What analysis sequence are you trying to solve?  Have you tried solving the analysis?  My training example model solves a Fill+Pack+Wire Sweep Detail (I can see my wire sweep results) yet my wires also show as disconnected via a Connectivity Diagnostic.

Mason

[pchandrasekar]

Hi Mason. Myers,

Thanks for quick reply.

I need to refer wire deformation so I have chosen fill+ pack + Wire seep details sequence.

I my case without connectivity issues if I perform simulation error message in log file " Error 3047140" some of the part cannot be reached by polymer flow.

At present connectivity issues is solved by some steps.

1.Initial we need to mesh with dual domain (part , insert , wire )

2.Next connect the part insert node with wire node (same we practice for gate and part insert connection) but if we check the connectivity at that time -- no connectivity between wire and part insert .

3.once we mesh the part , part insert , wire are all combined the connectivity issues is solved.

Thanks for the support @mason.myers and @bernor_mf 

It will be helpful some of the training material contain

1.Microchip encapsulation (study model with wire)

2.Deformation of wire sweep result.

same below link tutorial contain model , study file with results

https://www.autodesk.com/support/technical/article/caas/tsarticles/ts/1FLGBu4jyRP4y8GDvJE35C.html

[mason.myers]

Hello @pchandrasekar ,

Thank you for the update and I am glad you solved the issue.

You can purchase our Microchip training materials from Ascent:

https://www.ascented.com/courseware/product/autodesk-moldflow-insight-2021--microchip-encapsulation

Mason