Now that I got the mate to respond the way I want to I have a new problem.
After I place the core.ipt in the assembly (grounded) and place the wafer.ipt in the assembly when I mate them the wafer ends up flipped on one axis so the front is facing the core.ipt and the groove at the top is facing down.
This only happens when I mate them. When I place them in the assembly the orientation is correct.
