If I add a copper pour on my top layer (bottom layer is DGND), and give it the same signal name (DGND):
1) How does this copper pour connect to the DGND layer? I assume some kind of default via with some default spacing?
2) If I want this copper to be exposed (no solder mask), do I have to add a tstop polygon to the pour area?
Solved! Go to Solution.
Solved by mtl_asm. Go to Solution.
1) you have to add the via yourself. simply naming the pour will not automatically generated any physical connection. place a via then name it the same signal as the pour and it should connect to the 2 planes on each layer.
2) yes that should work.
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