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Ellectronics cooling results
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I have done some simulation on a electroics housing with a heat sink intergrated. On one side of the housing the PCBA is mounted on the outerwall on the inside.
I have done 3 simulations with the same condition only with differant wall thickness where the PCBA is mounted.
The results is that a thinner wallt hickness results in lower heat in the components.
Dimensions of the housing
Height = 80mm
Width = 250mm
depth = 155mm
My question is can I trust the results because I had aspected that the thickest wall would cool the best but in the results it is the thinner wall that performs best.
