Correct way to model a thermal load

[Anonymous]

Hello,

I have a doubt about the correct way to implement a thermal load. I have an electronic unit that has an internal generation of X watts. The unit is attached to a metallic plate; what I know is that the unit transfers 0.5 [W] to the metallic plate. I imposed this condition by introducing an Heat Source load at the surface in contact with the metallic plate and assigning -0.5[W]. I choose the negative number to indicate that the thermal flow is exiting the electronic unit. Can someone confirm that this is the correct way to model such a situation?

Thank you

[jorge_garcia]

Hi @Anonymous ,

I hope you're doing well. I would recommend using the E-cooling simulation in the Simulation environment. It sounds like you might be using CFD? In the E-cooling simulation you can assign heat loads to components in your design. You would enter the load as a positive number, the tool knows how to process it.

Let me know if there's anything else I can do for you.

Best Regards,