automatically generate pads on top and bottom layer

[annoying_numerate228]

Hello,

I'm new to this forum and I have just designed my first PCB.

I noticed that my pads were all on the top layer. But I would like to have them on the top AND on the bottom layer so I can later decide from where I want to place and solder my through hole component. And the inside of the hole should also be plated. How can I achieve this?

As an example how it should look like I have attached the top and bottom view of a logic level converter.

[jorge_garcia]

Hello @annoying_numerate228,

I hope you're doing well. All you have to do is just use vias and through hole pads to get plated through drills that connect on both sides.  

If you are new to PCB design, I'd recommend going through this tutorial

https://www.youtube.com/watch?v=_jgUZeBiusw&list=PLmA_xUT-8UlL80Xm8Gxz98YNum3I9GInr

Let me know if you continue to run into issues.

Best Regards,

[annoying_numerate228]

replied to the wrong one. sorry. This can be deleted

[annoying_numerate228]

Thanks for your answer. But I don't get this.

The pads I'm using seem to be PTH-pads. So there will be a hole created anyway. But why do I need additional VIAs? I can't even place the via on the PTH-pad. And how do I tell fusion 360 to create a pad on the top and the bottom layer, as this is not the case for standard VIAs?

[jorge_garcia]

Hello @annoying_numerate228,

I hope you're doing well. I think I am not understanding you correctly. Are you asking about getting surface mount pads on both sides?

It sounds like you don't want through hole pads, so I'm a little confused. Vias get annular rings on both top and bottom so I think there's something I'm not understanding.

Best Regards,

[annoying_numerate228]

hi, thanks for your answer!

Ok, maybe I got something wrong, when it comes about the wording. Basically I want the same as seen on the images I attached. That means want a solder pad on both sides, which has a hole inside. The inside of the hole is also plated and connects the pads on both sides.

So, how exactly is this called?

Round solder pads on the top and bottom layer of a VIA called annular ring?

Can I achieve my wish by editing the current footprint or is this only realisable when combining VIAs with plated through holes (PTH)?

best regards

[jorge_garcia · Accepted solution]

Hi @annoying_numerate228,

We call these plated through-hole pads or just pads. If we are talking about surface mount we might say SMD pads or something like that.

You'll see that the current footprint has the pads with green annular rings. Those annular rings automatically show up on both top and bottom by default. To achieve what you showed in the image you would just use the PAD command to make the pads of your components.

See the this video on making your own library parts

https://www.youtube.com/watch?v=8-tJZHFzWXo

Let me know if there's anything else I can do for you.

Best Regards,