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Sloted pads issue, BUG: LONG PAD rendered as ROUND in inner layers>Short circuit

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Message 1 of 4
javier.rodas
630 Views, 3 Replies

Sloted pads issue, BUG: LONG PAD rendered as ROUND in inner layers>Short circuit

This post is related to the https://forums.autodesk.com/t5/eagle-forum/slotted-pads/m-p/7487203  This issue is present on the latest 9.6.2 version for THREE YEARS now, even when it is in a "high priority list", as reported in previous post.

 

In my opinion there is a BUG present in the way LONG PADs are implemented in inner layers.

Using the Milling (46) layer IS NOT an option, as the LONG pads are rendered correctly in TOP & BOTTOM layers but they are implemented ROUND in ALL inner layers, and the slots/milling will short the ROUND PAD with the GND plane in inner layer when the slots are plated!.

 

When the slots are implemented using the Dimension (20) layer there is a copper gap around the milling that avoid the short circuits. But the LONG PADs are still implemented as ROUND PADs in the INNER layers, which is a BUG!.

 

It is time to FIX this!, please!!.

 

LONG pads with milling (46) slot, correct in TOP layer.LONG pads with milling (46) slot, correct in TOP layer.BUG!. LONG pads are implemented as ROUND pads in inner layers!. Short circuit between the plated slot and the GND plane in inner layer when implemented using Milling (46) layer.BUG!. LONG pads are implemented as ROUND pads in inner layers!. Short circuit between the plated slot and the GND plane in inner layer when implemented using Milling (46) layer.LONG pads with Dimension (20) slot, correct in TOP layer, but there are DRC issues reported..LONG pads with Dimension (20) slot, correct in TOP layer, but there are DRC issues reported..Workaournd. The layer Domension (20) avoids the short circuit between the ROUND PAD and the GND plane in inner layer!.Workaournd. The layer Domension (20) avoids the short circuit between the ROUND PAD and the GND plane in inner layer!.

3 REPLIES 3
Message 2 of 4
javier.rodas
in reply to: javier.rodas

Dear @jorge_garcia It's been already 3 weeks since I opened this post without any response.

 

Do you have any plan to improve in any way how the THT PADs (on custom footprints) and/or custom VIAs are implemented in multi-layer PCBs in Eagle?.

We own a Fusion360 + Eagle Premium account and we deserve any kind of response from you...

 

Thank you.

Message 3 of 4
javier.rodas
in reply to: javier.rodas

So, no answer after 5 weeks... I imagine then that this part of Eagle is not getting improved... at least not soon 😔

Message 4 of 4
jorge_garcia
in reply to: javier.rodas

Hi @javier.rodas,

I hope you're doing well. Sorry I missed this, so to start off this is not a bug it is actually by design. With that said we agree this needs to be improved but we don't have a specific timeline right now.

I wish I had better news for you.

Best Regards,


Jorge Garcia
​Product Support Specialist for Fusion 360 and EAGLE

Kudos are much appreciated if the information I have shared is helpful to you and/or others.

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