This post is related to the https://forums.autodesk.com/t5/eagle-forum/slotted-pads/m-p/7487203 This issue is present on the latest 9.6.2 version for THREE YEARS now, even when it is in a "high priority list", as reported in previous post.
In my opinion there is a BUG present in the way LONG PADs are implemented in inner layers.
Using the Milling (46) layer IS NOT an option, as the LONG pads are rendered correctly in TOP & BOTTOM layers but they are implemented ROUND in ALL inner layers, and the slots/milling will short the ROUND PAD with the GND plane in inner layer when the slots are plated!.
When the slots are implemented using the Dimension (20) layer there is a copper gap around the milling that avoid the short circuits. But the LONG PADs are still implemented as ROUND PADs in the INNER layers, which is a BUG!.
It is time to FIX this!, please!!.
Solved! Go to Solution.
Solved by jorge_garcia. Go to Solution.
Dear @jorge_garcia It's been already 3 weeks since I opened this post without any response.
Do you have any plan to improve in any way how the THT PADs (on custom footprints) and/or custom VIAs are implemented in multi-layer PCBs in Eagle?.
We own a Fusion360 + Eagle Premium account and we deserve any kind of response from you...
Thank you.
So, no answer after 5 weeks... I imagine then that this part of Eagle is not getting improved... at least not soon 😔
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