ratsnest - traces between polygon and IC pad is thin

[Anonymous]

Dear team

I got feedback that

the traces between polygon and IC pad is too thin so it cannot handle large current and it's bad for power dissipation.

I'm currently using EAGLE 9.4 on a MacBook Mojave and OSHPark's DRC file.

https://docs.oshpark.com/design-tools/eagle/design-rules-files/

The vendor wants me to make a thick trace like this example layout; the footprint is covered/flooded to the polygon.

The GND pins and the GND pad is connected to the GND polygon.

When I type the ratsnest command, it creates thin traces.

- How can I make the trace between the polygon and the component thicker?

- Additionally, can I ask what is the white square created by the via? What layer generates this diamond shape square?

[jorge_garcia · Accepted solution]

Hello @Anonymous,

I hope you're doing well. The picture your board house sent indicates that they don't want to see thermal relief(that's what those thin traces are called, they help heat build up to make a good joint. If this board is intended to dissipate a good amount of heat then they would be undesirable since by their nature they retain heat).

You can make the change simply, click on one of the outline segments of the polygon and look in the inspector. You'll see a checkbox that says thermals, make it unchecked. Once that's done click Ratsnest and you'll see that the connections to the polygon are all solid, in other words the pads get swallowed up by the polygon.

To answer your other question the square created by the via is a drill symbol. It is not drawn on the manufactured PCB. It aids in the creation of drill tables and identifying the different types of drills in a design.

Let me know if there's anything else I can do for you.

Best Regards,

[rachaelATWH4]

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@jorge_garcia wrote:

You can make the change simply, click on one of the outline segments of the polygon and look in the inspector. You'll see a checkbox that says thermals, make it unchecked. Once that's done click Ratsnest and you'll see that the connections to the polygon are all solid, in other words the pads get swallowed up by the polygon.

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Alternatively, if thermal relief IS required but the size of the relief connections is required to be larger then change the line width property of the polygon which will in turn adjust the thermal relief size.

Best Regards,

Rachael

[Anonymous]

Dear Jorge

Deeply appreciate your help.

You are mentioning the orange circled option, right? After I uncheck it,

"pads get swallowed up by the polygon. "

I'm amazed; it seems like the pads are buried into the plain.

One more thing; is there a way to swallow certain pads, not all?

I drew a big GND plain using the polygon command. If I disable the thermal option,

every component connected to the plain becomes swallowed too.

I just want to swallow certain components. Instead of drawing multiple polygons, is there a way to certain components?

[Anonymous]

Thanks, Rachael.

" but the size of the relief connections is required to be larger "

I think I need this option.

"change the line width property of the polygon which will in turn adjust the thermal relief size"

May I ask which width you are referring to?

[rachaelATWH4 · Accepted solution]

This one: