All of My connections in circuit is on bottom layer , but i want to make pad which have can i solder it in the bottom side and in the top layer i do not want to solder it and leavet as hole(like example in the attachment) , so how can i do that in eagle?
All of My connections in circuit is on bottom layer , but i want to make pad which have can i solder it in the bottom side and in the top layer i do not want to solder it and leavet as hole(like example in the attachment) , so how can i do that in eagle?
Hi @Anonymous,
please take look into the Design Rules. In the Annular Ring settings change the value for the Top layer to 0, i.e minimum and maximum limit = 0. This works for all parts with pads that have Pad diameter set to "auto" in the library.
You will not see an immediate effect in the layout, but if you switch the layer color of the Pad layer to the background color, the pads are drawn in a combination of the signal layer colors. There you can recognise the difference in diameter in the different signal layers.
I hope this information helps.
Regards,
Hi @Anonymous,
please take look into the Design Rules. In the Annular Ring settings change the value for the Top layer to 0, i.e minimum and maximum limit = 0. This works for all parts with pads that have Pad diameter set to "auto" in the library.
You will not see an immediate effect in the layout, but if you switch the layer color of the Pad layer to the background color, the pads are drawn in a combination of the signal layer colors. There you can recognise the difference in diameter in the different signal layers.
I hope this information helps.
Regards,
So what about the other pads which have shape not round , or it dosen’t have diameter as automatic setting , it dosen’t work .
if i make cam process and in the top layer i did not select the pads to show , so when we print the pcb the pads will not dissaper !!,Is this soultion solve the problem ?
thank you
So what about the other pads which have shape not round , or it dosen’t have diameter as automatic setting , it dosen’t work .
if i make cam process and in the top layer i did not select the pads to show , so when we print the pcb the pads will not dissaper !!,Is this soultion solve the problem ?
thank you
I'm really not clear what you're asking here. The board in your photos is a single-sided board - it does not have a top layer. The way you achieve this in Eagle is to route everything on the bottom layer then generate your CAM files for a single-sided board - i.e. you do not generate (or, if it's easier, simply don't include in the bundle for your board house) the top copper, solder mask and paste files. You may still want the silkscreen.
I'm really not clear what you're asking here. The board in your photos is a single-sided board - it does not have a top layer. The way you achieve this in Eagle is to route everything on the bottom layer then generate your CAM files for a single-sided board - i.e. you do not generate (or, if it's easier, simply don't include in the bundle for your board house) the top copper, solder mask and paste files. You may still want the silkscreen.
Thanks!
It solved my problem.
Thanks!
It solved my problem.
Hello there,
I tried it. It even works with pads having square shape. But the diameter should be set to auto.
Hello there,
I tried it. It even works with pads having square shape. But the diameter should be set to auto.
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