Hi everyone,
I am relatively new to Eagle PCB (currently on version 9.6.2), and I wanted to know if there was a way to populate a "proper" soldermask and solderpaste for polygon shaped SMD pads in the footprint editor.
In my case, I've created a footprint with a triangle shaped polygon that I've placed on top of a regular rectangle SMD and created manually the soldermask and solderpaste layers (tstop and tcream). As I had this footprint to my layout everything goes well no errors.
The issue comes when I finalized my layout and create the Gerber files to send to a manufacturer. The Gerber file preview show that my special shaped SMD pads are full on all layers (copper, soldermask, solderpaste layers). But when I import the Gerber files for quality inspection on top of my layout in Eagle these polygon shaped SMD pads's soldermask and solderpaste layers are cutout, it only displays the contour of the shape instead of filling them up.
So, is there a way to have the soldermask and solderpaste Gerberfiles filled when creating special/polygon shaped SMD pads in the footprint editor?
Example: In the layout screenshot the solderpaste is in yellow. The rectange SMD pad is filled up but not the triangle one.
