- Mark as New
- Bookmark
- Subscribe
- Mute
- Subscribe to RSS Feed
- Permalink
- Report
I need help to understand how to connect Vias properly on multi-layer PCBs.
I created a 4 layer PCB (Top - GND - V3.3 - Bottom)
Then I created a cutout area in the copper on all 4 layers around the crystal. Then created a copper fill area for a local ground on Layer 2 (GND plane). Now I want to connect on layer 1 to the local ground plane below the crystal with a via.
The copper pour on layer 2 is named GND:
But I don't get it done properly. I tried:
1) Adding a via on top layer, and naming it GND, but then it connects to the ground pour on the top layer.
2) Adding a via on the second layer, and tried to route a wire to that via, but also this does not work as the via is then circumvented.
The grey outline is the polygon I created as a local copper fill, for the ground plane below the crystal on Layer 2. As there is no connection made yet, it does not fill.
How do I connect from the load capacitor C17 to the local ground plan on Layer 2?
I also tried starting with a trace, adding via and switching trace to layer 2 (GND) but it still does not fill the pour when hitting the ratsnest button.
Solved! Go to Solution.