Hi @Anonymous ,
beside the information from @beth.mollica I think you need to review results and process settings in detail.
As the clamp force increase in CFPW sequence, the Cooling seems to have an effect on the pressure to fill.
FP sequence uses the same mold temperature around cavity.
CFPW calculates the mold temperature. So maybe an area cools too fast?
Do you use packing pressure percent (%) of injection pressure (% Filling pressure)?
Adding Cool to your sequence, and you might get an early freeze off somewhere in part and maybe an unbalanced fill, which will increase injection pressure, and pressure spikes?
Hence it increase packing pressure, and affect clamp force needed if using packing pressure as an % Filling pressure.
So review and compare result Pressure at V/P Switchover for FP and CFPW sequence first.
Is there a big difference? If, analyze why.
Review process settings pack/holding control.
Maybe use absolute packing pressure for the FP and CFPW sequence to get comparable results?
Hope this helps.
Regards,
Berndt
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