how to simulate this kind of cooling type?

[flyinthesky]

can anyone know how to simulate this type of cooling in moldflow?please see the attchment what i uploaded.i need you help..thank you in andvance...

[flyinthesky]

it is not a bubble,it is a cooling pump....

[mppkumar · Accepted solution]

Hi @flyinthesky

I believe it's a thermal pin used to cool those regions

unfortunately, thermal pins can't be modeled or simulated using Moldflow

[flyinthesky]

Ok,thank you very much...

[bernor_mf]

Hi,

it has been requested to add thermal pins in Moldflow IdeaStation:

Thermal pins

It was raised over 3,5 years ago, and still "gathering support"

Kudos it, if you want.

Regards,

Berndt

[mppkumar]

Hi @bernor_mf

Agree with you... thermal pin cooling option should be included in Moldflow

Gave kudos to that post too 

Expect positive reply from Autodesk team

[madhukeshwart]

1. It can be Copper  alloy pins likewise exchange heat to the cool medium, however do not exchange heat as fast as thermal pins. Aside from copper, beryllium- copper might be employed. The complete core insert could be made from a copper alloy. Heat is shifted from the molding region to the cool medium channel. It is employed where bubblers, baffles, plus water fountains would be a structure trouble.

 2. It can be Thermal pin heat up conductors are usually employed inside cores, core slides besides other regions of a mold, where demand cooling or manipulated temperatures. They exchange heat quickly to the cool medium as demonstrated below, as an alternative to moving coolant towards a heated region. Commonly employed in location of bubblers, baffles, together with water fountains.

3. Mold flow does not currently have a direct way of creating cooling/thermal pins. 

A workaround would be to create the pin as a part insert, then assigning it with the conductivity properties it is to have in reality. Experimentation may be necessary to determine if it is better to create it using Dual Domain elements or 3D elements.  

Some research would need to be done on the thermal pin being used to determine an appropriate value.  Moldflow is not able to predict thermal pins perfectly as thermal pins use the latent heat of evaporation and condensation to move heat from the source to the sink. That means that heat is moving without a physical temperature gradient being present. The provided workaround should be able to capture it to some degree.

https://knowledge.autodesk.com/search-result/caas/sfdcarticles/sfdcarticles/How-to-create-Cooling-Pi...