what is the Analysis Type for Heatsink Heat dissipation Simulation

[mar.wen]

Hello, I would like to know which analysis type under Inventor Nastran In-cad should I use for the below set-up:

-heatsink is touching the top surface of the device

-above the heatsink, there is a fan

-the device is in a housing structure.

I know the device temperature and the ambient temperature.

The customer would like to know by Simulation if we will be able to dissipate the heat (in watts) they provided us.

No need to provide me detailed information about how to do it but, of course, I will appreciate it if ever you would go that extra mile to assist me. Thank you!

[mar.wen · Accepted solution]

It's all okay now. Maybe, it's just a bug.

[John_Holtz]

Hi @mar.wen 

Your comment "It's okay now" and marked as a solution were attached to the wrong forum post. You have another forum post that should be marked as solved. This forum post about the thermal analysis does not have an answer yet.

This forum post can be solved by either steady state heat transfer or transient heat transfer, depending on whether the analysis is steady state or transient. You do need to make some assumptions if using Inventor Nastran to solve the analysis:

• The inlet and outlet air temperature are the same.
• You do not model the air, and therefore, the air does not transport heat to any other portion of the model.
• Essentially, you need to calculate the coefficient of convection and apply that to the model to simulate the effects of the air blowing around the model.
• Radiation is negligible.

If any of those assumptions are to approximate, then you can use Autodesk CFD to model the air and perform a combined fluid flow-heat transfer analysis.