Thermal Study - Cooling for electronic devices

sta.schaefer
Observer
Observer

Thermal Study - Cooling for electronic devices

sta.schaefer
Observer
Observer

Using the thermal cooling simulation tool, I found that air particle traces pass through a solid aluminum enclosure , modeled around the internal device volume (see cross-section below). As a result, air flow is marginally exiting enclosure through designated venting holes.

Steps tried to fix the problem without success:

  • Components intersections were fixed
  • Simulation accuracy was set from medium to highest

Bildschirmfoto 2023-10-31 um 23.01.23.png

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