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September 2021 Fusion 360 Electronics Update

5 REPLIES 5
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Message 1 of 6
edwin.robledo
269 Views, 5 Replies

September 2021 Fusion 360 Electronics Update

Hi,

We appreciate your participation in the Fusion 360 electronics forums, and your question and collaboration provide invaluable information to our community. When you launched Fusion 360 this morning, you may have noticed that there was an update alert, and I want to let you know about new and improved features:

New! Package generator type – SMD Header Right Angle(Male)

File > New Electronics Library > Create New Package >

We have added a new package type, Surface Mount Male header (Right Angle), which supports single & dual rows along with customized footprint (non-IPC derived).

RightAngle1.pngRightAngle2.png

They are generally used in board stacking applications by connecting PC board-board without a cable (by mating with a receptacle connector).

 

New! New library parts - IC_Embedded, Sensor

File> New Electronics Design > New Schematic > Add part

We have added popular 8, 16, and 32-bit microcontrollers to the IC_Embedded library in this release. Also, the iCE40 LP family FPGA was added from Lattice, which is intended for ultra-low power applications in portable devices like wearables.

FPGA1.pngsensor.png

In addition to that, we also added battery charger IC’s, LED drivers, and a couple of sensors like Accelerometer, Gyro, Photocell etc.

 

Improved! Added images in the footprint tab for all Thru-hole types for better visualization.

File > New Electronics Library > Create New Package >

We have added separate images in the Package generator footprint tab for each package according to its type. Though there is no functionality change, this improvement will help to easily visualize the package than the older version that only has pad and hole detail.

image1.pngimage2.png

Thank you for taking the time to review the latest updates for Fusion 360 electronics. 
Best Regards,

Ed

 



Edwin Robledo
Tech Marketing Manager
5 REPLIES 5
Message 2 of 6
ImDaveM
in reply to: edwin.robledo

Hi Ed,

 

Can you please tell us what is happening with PCB Panelizing feature? We have been waiting years for this!
Also, we were told we are getting a ROAD MAP of Fusion Electronics features, has this been released yet?

regards. Dave M

Message 3 of 6

Hi @ImDaveM ,

 

I hope you're doing well. We've been exploring the future of panelizing functionality recently, there's no ETA for it yet but much of the core functionality is already available in Fusion 360 in preview. We still have a lot of work to make that real but some pieces already exist.

We did a roadmap video a few months ago, we should probably do another one soon. At least that's what it sounds like. 🙂

 

Let me know if there's anything else I can do for you.

 

Best Regards,



Jorge Garcia
​Product Support Specialist for Fusion 360 and EAGLE

Kudos are much appreciated if the information I have shared is helpful to you and/or others.

Did this resolve your issue? Please accept it "As a Solution" so others may benefit from it.
Message 4 of 6
ImDaveM
in reply to: jorge_garcia2

Hi Jorge,

 

I had a look in preview and could not see any PCB Panelising features in there?

 

The thing is we have been discussing panelising for years now, its a basic feature needed for PCB design. But Autodesk just keeps adding many new and very complex features, but seem to be ignoring the basics.

 

Another BASIC feature missing from FUSIOn 360 is a realtime Bill of materials system.

It very hard to incorporate builds of products (BOMS) into an inventory/purchasing system.

 

Do you have a link to the last roadmap video for Electronics?

 

Thanks

 

Message 5 of 6

Hi @ImDaveM ,

 

I was referring to the simplify and arrange tools that already come in Fusion 360. You can enable them by clicking the checkbox in the preferences dialog.

 

EnableArrangeandSimplify.png

 

I know from a previous post, that you want to see all of this in the electronics environment. However, one of the benefits of being in Fusion is that you can leverage existing infrastructure. The Nesting algorithms in Fusion are best in class and it's something that isn't just limited to sheet metal or laser cutting, they could also be used very effectively in PCB manufacturing. The missing piece right now(which is a rather large piece I'll admit) is being able to pull in the panel to the 2D PCB and then adding v-scores, mousebites, slots etc. With that said if you play with the feature you'll see that you can make a very efficient(in the sense of space utilization) panel arrangement even with disimilar boards with very little effort. We have a ways to go but knowing we have access to that technology already is going to speed up being able to deliver the tools.

 

Fully agree, on the BOM tools. We already have some code on this front completed but we still have more work to do till it's done.

 

Here's the link to the roadmap webinar we did in February https://www.youtube.com/watch?v=Kszb3FPjSpE

Let me know if there's anything else I can do for you.

 

Best Regards,



Jorge Garcia
​Product Support Specialist for Fusion 360 and EAGLE

Kudos are much appreciated if the information I have shared is helpful to you and/or others.

Did this resolve your issue? Please accept it "As a Solution" so others may benefit from it.
Message 6 of 6
ImDaveM
in reply to: edwin.robledo

Thanks Jorge,

 

I will have a look at those new features, to see if it can help, but i don't think it will.

Keep in mind when the panelization feature is implemented in fusion electronics, please don't switch to the arrange window, unless it has ONLY the tools for PCB's . I would prefer to stay in PCB environment.

 

thanks

 

 

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