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How is PCB modeled in Fusion360 electronics cooling simulation tool?

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Message 1 of 4
wzohni55DN2
579 Views, 3 Replies

How is PCB modeled in Fusion360 electronics cooling simulation tool?

Hello,

I have a few basic questions regarding solid modeling of PCBs for use in Fusion360 electronics thermal simulation:

 

1) for a PCB model built within Fusion360 - is the PCB solid model meshed fully "as is" or is it automatically simplified within the simulation tool?  In either case, is it possible to view the resulting finite element mesh?

 

2) can gerber or other shared PCB design file formats be imported into the Fusion360 electronics cooling simulation tool?  If so, what file formats are supported?

 

3) are there any other suggestions for how to import or represent complex multi-layer PCB designs in Fusion360 for purposes of thermal and mechanical simulation?

 

Thanks,

Will

3 REPLIES 3
Message 2 of 4

1) for a PCB model built within Fusion360 - is the PCB solid model meshed fully "as is" or is it automatically simplified within the simulation tool?  In either case, is it possible to view the resulting finite element mesh?

The PCB is currently meshed exactly as it is represented in the 3D model from where you elected to start an ecooling simulation.  The two options to enter into an ecooling simulation are directly from 3D PCB Design or from Fusion 360 Design Environment. Therefore if you have copper traces modeled in the 3D model, they will be a part of the thermal simulation.  There is a caveat.  In order to have the extreme geometry tolerance and never subject the user to the need to modify geometry just to get a mesh, electronics cooling uses a voxel grid.  The voxels are actually quite small and capture a ton of detail, but there is always a possibility of an even smaller piece of geometry. Therefore, small copper layers if they are smaller than the voxel size may not be represented to the solver.   Also, Fusion can handle the copper layers and all it's complexity, but they do represent a significant % to the model size. In an ideal world we find ways to mitigate this type of burden wherever we can. Due to these two challenges, we are investigating automated ways to represent idealizations of the PCB.  The idealizations would take into account localized variation of copper, vias, etc. without having to mesh them directly or even possibly carry the weight of the exact graphical representation for the ecooling simulation.  We are in technical preview for ecooling, so any advancements in this regard will be communicated as they become available in the product.

 

2) can gerber or other shared PCB design file formats be imported into the Fusion360 electronics cooling simulation tool?  If so, what file formats are supported?

The entry point into electronics cooling simulation are from Fusion Design or 3D PCB.  One of our electronics design experts might need to comment with more detail on best how to get Gerber or other file formats into Fusion for the purpose of electronics design.  

 

3) are there any other suggestions for how to import or represent complex multi-layer PCB designs in Fusion360 for purposes of thermal and mechanical simulation?

My focus has been on the thermal aspects of electronics design holistically.  The tech preview of e-cooling currently deals with the PCB as a what you see is what you get analysis as long as the details are not smaller than the voxel size.  As stated in 1) above, we are investigating methods to ensure future idealizations of complex multi-layer PCB designs would take into account localized variation of copper %, vias, etc. without having to mesh them directly.

Heath Houghton
Principal Business Consultant
Message 3 of 4
edwin.robledo
in reply to: wzohni55DN2

Hi  Will,

Thank you for participating on the Autodesk Fusion 360 forum. 

2) can gerber or other shared PCB design file formats be imported into the Fusion360 electronics cooling simulation tool?  If so, what file formats are supported?


At this time Fusion 360 is only compatible with EAGLE designed files.

Best Regards,

Ed

 

 

 

 

 



Edwin Robledo
Tech Marketing Manager
Message 4 of 4
wzohni55DN2
in reply to: edwin.robledo

Thanks a lot for the feedback.  Information is clear.

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