Fusion Electronics
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heat spreading in cooling analysis

Message 1 of 2
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heat spreading in cooling analysis

Is there any support for heat spreading such us a vapor chamber, or graphite spreader?  Any support for interface materials between the spreader, IC, and heatsink?


Thank you

Message 2 of 2

In Fusion Electronics cooling, the calculations support conduction and convection in solid parts/bodies and the fluid domain. The heat sink is the only idealization model that is currently available and is dedicated to the extruded fin heat sink. There are no special models dedicated to vapor chambers, graphite spreaders, and interface materials between components. However, it is possible to define a solid body with a higher thermal conductivity allowing us to simulate the mentioned things. A higher thermal conductivity would model more efficient heat spreading.

Igor Krolikowski
Software Development Manager
Product Design & Manufacturing
Autodesk, Inc.

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