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Creating QFN package microcontroller and I need a ground plane where the thermal pad is.

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areid2LDKE
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Creating QFN package microcontroller and I need a ground plane where the thermal pad is.

I am trying to create a schematic symbol and PCB footprint/part.  The chip I am using has a ground plane where the thermal pad is located.  So I don,t know if it is possible, but I need to replace the thermal pad with a ground that has a usable pin.  Is this doable in Fusion 360, and how can I do that?  In the QFN generator it is not an option.

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silvio3105
in reply to: areid2LDKE

That ground pad/thermal pad is pad just like any other pad.
From my experience, thermal pad is in most cases connected to GND, but check chip's datasheet first.
So, you create symbol with pins and name them like in datasheet.
After symbol, you create footprint with pads and name them by number(1, 2, 3, etc..), name thermal pad something like TH.
After that you can symbol and footprint. Only thing that is left is to combine symbol and footprint into the device. Device holds info about pin->pad connections. You connect pin(from symbol) with pad(from footprint). One pin can have multiple pads.

Creating symbol: https://www.youtube.com/watch?v=-LWLXkMUcbk
Creating footprint: https://www.youtube.com/watch?v=8-tJZHFzWXo
Creating device: https://www.youtube.com/watch?v=2GVqwGs8qc8

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