Create custom package in electronics library

[MarietjieBlignaut]

Good day,

I am busy creating a unique package for a custom unit in an electronics library. I would like to place unique shape copper on the top layer with a hole inside. So I've placed a through hole pad in the top layer polygon, but then the polygon copper shape is also poured on the bottom side.

I've also tried placing a hole in a SMD pad, but then I can't achieve the unique shape without several errors.

Is there any way to do this without copper going to the bottom side or without errors? 

[jorge_garcia]

Hi @MarietjieBlignaut ,

I hope you're well. It sounds like you don't even want the annular ring on the bottom of the board. Is that correct? In that case the best option is to use a plated through hole via and set it's diameter to be very small. Then on the top layer you draw a polygon to extend that through-hole via's copper.

One thing you need to be very aware of, small annular rings are hard to manufacture and they should be avoided. In fact when you place the component on the board you'll notice that the pads will swell to conform to an annular ring minimum. If this is not acceptable you'll have to adjust the DRC to make it work. 

Let me know if there's anything else I can do for you.

Best Regards,