Fusion
Hi,
I want to begin the post by expressing our gratitude for your participation in our very active forum. I want to let you know that it is closely monitored by all our teams that are involved in the development of Autodesk Fusion electronics, and your comments and workflow experience are being considered for every update. We have recently deployed the latest update, and it is packed with features that will enhance your design experience and optimize your workflow flow.
Follow this link to review the latest updates for Autodesk Fusion.
The list of improvements is rather extensive, but I will do my best to summarize it the best I can. That way, you can start taking advantage of them now.
Cross Selection
The cross-selection allows you to highlight assets in the schematic, which will be highlighted on the PCB, and vice versa. It was handy when tracking down multi-gated components or a particular signal. It is supported if you are working on multiple or single monitors using the tabs.
Via Stitching
It is a highly coveted feature that will make filling available areas with vias much easier to create a better connection for a ground plane on different layers—often used to generate an array of vias for thermal solutions on your PCB. You will find the Via Stich option in the list of route options. In the Dialog box, you will see the option to cover the entire board in which the outline needs to be defined or define a particular area. Ensure that you notice the field to determine the name via stitch. The via stitch can be located in the Device Manager; highlight the signal in the properties, and you will notice the Via Stich. Moving assets around a via stitch pour will automatically force a pour.
Signal Integrity Extension powered by Ansys: Coupling
Our partnership with Ansys empowers our Fusion user to use the power of Ansys MoM solver to provide insightful capabilities for Signal Integrity simulation in Fusion Electronics. We initially offered all the impedance and parasitics for your simulation analysis, but this time, we have used the solver's power to simulate cross-talk. Now, you can review how nearby traces are affecting your critical signal. Make changes in distance, add a polygon, change your dielectric, and re-analyze to see if you have acceptable results. The simple interface makes it easy to interpret your results.
Pad Management
Not too long ago, I was chatting with one of our experts and stated the pad management feature will now provide the means to break down a BGA without being subject to the constraints that would not let us get closer to the nonconnected pads. You will notice this option in the DRC/Annular Ring. You can now reduce the annular ring size for such pads and vias, freeing up valuable space for routing on your internal layers, streamlining the support for High-Density Interconnect (HDI) PCBs, and mitigating return and insertion losses at high frequencies.
Keyboard Shortcut: Space Bar
Improving user interface functionality, the Space Bar now rotates components in the electronic design workspace. This intuitive addition complements the existing right-click rotation method.
Panel Handling
The resizing issue with undocked panels in electronics has been resolved. You can now smoothly adjust the size of floating and tabbed panel groups, enhancing user interaction.
Add-Ins
Some users reported that the dialog would go blank in some situations when using add-ins such as Ultra Library or SnapED. This latest update has identified and corrected the issue.
Cadence Partnership: Electromechanical workflow
Autodesk Fusion's integration has significantly enhanced Cadence Allegro X and Orcad X's capabilities, enabling the utilization of Fusion's advanced 3D PCB design infrastructure. This synergy allows Cadence users to craft or import complex PCB outlines from projected enclosures directly into the Allegro X or Orcad X environment, streamlining the electromechanical design process. Concurrently, mechanical engineers can utilize Fusion's design features to optimize component placement, which electrical engineers can swiftly assimilate using Edit in Place.
Spice Update: Export
You will now have the option to export your Spice Simulation results in spreadsheet format. Empowering you to use your data and extract more from your simulation.
It may have taken a bit longer than expected to provide you with all the details, but I wanted to ensure you were aware of all the new capabilities. I hope this helps, and keep innovating with Fusion Electronics!
With Warm Regards,
Ed
Edwin Robledo
Tech Marketing Manager
