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A good example would be the four through hole mounting pegs in each corner of a usb connector (e.g., https://www.molex.com/pdm_docs/sd/2171790001_sd.pdf).
My approach to adding these holes to a footprint has been:
1. use the smd pad tool to draw the outer shape according to dimensions and radius provided in the datasheet.
2. use the rectangle tool on layer 46 (milling) to draw the hole (I would also use the miter tool if the hole corners have a radius, as they do for the Molex usb linked above).
I have run into some problems with this approach.
1. The holes do not appear to be reflected in the 3D model of a PCB which uses this device (not a huge problem so long as the PCB fabricator is aware that a hole is requied).
2. The holes are not acting as a via between top and bottom layers (e.g., in the case of the Molex usb linked above, I would expect these holes to act as a via between top and bottom GND planes).
Is there a better way to add plated mounting holes to a device footprint?
Solved! Go to Solution.
