material for use in cooling simulation

[eric_engineer]

Hi, I'm working on an electronic cooling project in fusion 360. Very simple just an IC, heatsink, and maybe a fan.  I can never figure out the right material to choose for the IC (which is the heat load). It's a normal plastic encapsulated package, the standard black ICs, sometimes called "Epoxy Mold Compound"  Any idea what the right thing to pick here is?

Thank you.

[jorge_garcia · Accepted solution]

Hi @eric_engineer,

I've reached out to my e-cooling colleagues and they will correct me if I'm wrong here. By default there is an generic electronic component material. This is what you should use for IC bodies.

Let me know if there's anything else I can do for you.

Best Regards,

[eric_engineer]

Okay, I think it is called "discrete component".  That took a while to find, the docs and videos on this feature are kind of scattered around.

Thank you.

[igor.krolikowski8YYUQ]

The most important would be to verify the thermal conductivity material properties: model vs reality.