How to use stacked components (like IC-sockets) ?

[PinRudolf]

Hi,

I'm fairly new to Fusion Electronics and I'm not yet grasping some of the basic workflows:

I'm trying to make a PCB using IC-sockets with the IC on top. What I'm trying to accomplish here is that I want the 3D-file to have the correct data (using the socket my IC sits up higher) and I also want to grab the correct Bill of Materials from my schematics.

Initially I intended to use two different components, but as they both had pads they could not put in the same place. 

Currently I'm using devices which both contain the 3D information of the socket and the IC stacked together. Silly me just realized that this will mean that only one device will show up in the Bill of Materials. Is there any way I can make it show like two separate devices? (Like a sub-assembly)

Or will I need to create a seperate IC-socket without a symbol and footprint and just use the 3D package? This will however be harder to work with as orienting the component will be a bit difficult as well as rising the IC.

Are there better solutions?

Thank you kindly!

[mick_pope]

Hi,

Did you figure this one out? I have a similar use case with a LED and LED Spacer where I need the parts list to be correct for the 3D model to be accurate.  I've looked and looked and can't find the solution.

Thanks

[PinRudolf]

I'm affraid I have not found a better solution.

[jorge_garcia]

Hello @PinRudolf and @mick_pope,

I'm going to report this as a feature request. There's never been an ideal solution for this, everything required some form of compromise.

Let me know if there's anything else I can do for you.

Best Regards,