How do I configure for a 2 layer board?

[acsann]

I am about to finish my first schematic and then start the 2D PCB design. Where in the process do I tell F360 the I want a two layer board? Assuming later that I determine I need to make it 4 layer, how would I accomplish this? And where is this documented? 

[yqliu · Accepted solution]

Hello @acsann,  the board is 2-layer by default. If you want to setup 4-layer or more, you can do it in DRC:

[acsann]

Thanks for your comment. I am still confused about the layer system. While the 2 layer drawing in DRC is simple there are a lot of other layers in F360. Is there a document that explains the layering in F360 and shows the purpose of all the layers? Could you walk me through the steps to move from 2 layer to 4 layer? 

[acsann]

@yqliu can you help me with my question above?

[yqliu]

@acsann, the layers in Fusion electronics is the same with that in EAGLE. I'm just copying the predefined layers here for your reference:

Predefined Layers

Layout

1 Top	Tracks, top side
2 Route2	Inner layer (signal or supply)
3 Route3	Inner layer (signal or supply)
4 Route4	Inner layer (signal or supply)
5 Route5	Inner layer (signal or supply)
6 Route6	Inner layer (signal or supply)
7 Route7	Inner layer (signal or supply)
8 Route8	Inner layer (signal or supply)
9 Route9	Inner layer (signal or supply)
10 Route10	Inner layer (signal or supply)
11 Route11	Inner layer (signal or supply)
12 Route12	Inner layer (signal or supply)
13 Route13	Inner layer (signal or supply)
14 Route14	Inner layer (signal or supply)
15 Route15	Inner layer (signal or supply)
16 Bottom	Tracks, bottom side
17 Pads	Pads (through-hole)
18 Vias	Vias (through-hole)
19 Unrouted	Airwires (rubberbands)
20 Dimension	Board outlines (circles for holes)
21 tPlace	Silk screen, top side
22 bPlace	Silk screen, bottom side
23 tOrigins	Origins, top side
24 bOrigins	Origins, bottom side
25 tNames	Service print, top side
26 bNames	Service print, bottom side
27 tValues	Component VALUE, top side
28 bValues	Component VALUE, bottom side
29 tStop	Solder stop mask, top side
30 bStop	Solder stop mask, bottom side
31 tCream	Solder cream, top side
32 bCream	Solder cream, bottom side
33 tFinish	Finish, top side
34 bFinish	Finish, bottom side
35 tGlue	Glue mask, top side
36 bGlue	Glue mask, bottom side
37 tTest	Test and adjustment inf., top side
38 bTest	Test and adjustment inf. bottom side
39 tKeepout	Nogo areas for components, top side
40 bKeepout	Nogo areas for components, bottom side
41 tRestrict	Nogo areas for tracks, top side
42 bRestrict	Nogo areas for tracks, bottom side
43 vRestrict	Nogo areas for via-holes
44 Drills	Conducting through-holes
45 Holes	Non-conducting holes
46 Milling	Milling
47 Measures	Measures
48 Document	General documentation
49 Reference	Reference marks
51 tDocu	Part documentation, top side
52 bDocu	Part documentation, bottom side

Schematic

91 Nets	Nets
92 Busses	Buses
93 Pins	Connection points for component symbols
	with additional information
94 Symbols	Shapes of component symbols
95 Names	Names of component symbols
96 Values	Values/component types

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