3d board view flip components does not take into account angle

[hex705]

Hi All,

I realize most people build circuits on a rectilinear grid -- but I don't (at least, not this time).

In 3d view, I used Modify--> Flip 3d PCB component -- and those aligned to 0,90,180 degrees flipped fine.  Those on 30 degrees did not.

Header pins not on main axes do not flip properly. 

TOP: when flipped headers on angles no longer align with pads

BOTTOM: when flipped headers on angles no longer align with pads

Is there a way to ROTATE these headers in 3D view?   I don't want to move the pads -- I want to rotate the 3D packages to align with the pads. 

Is this a bug or a user error, or something that can be solved somewhere in the tool chain? 

Thanks in advance for advice.

s

[yiqiu.han]

Hi, @hex705 

One word answer is that you just need to push change to 2D and then view in 3D again to get pads updated to the correct position.

The reason why you need to do a round a push<>pull is that at current pad position update in 3D PCB needs to be transformed from 2D PCB. For move command, there're two checkboxes in the command panel, only when these two options are checked route wires and pads would be updated after change executed, However, It would cost more time compare with simply flip/move operation.

Hope that helps~

-Yiqiu

[hex705]

Hi @yiqiu.han  

Thanks for getting back to me -- i missed this last week; my apologies for my delay. 

The pads in the images above are in the correct position.  

When the pin headers are on the other (top) side of the board they were in the right position too.  ( This is how they were placed by the software). 

When I manually flipped all the headers to the bottom of the board (how they will be soldered) the headers NOT on 90 degree grid get represented at the incorrect angle. 

The workflow of push to 2d and return to 3d does not change this.

steve

[yiqiu.han]

Hi, @hex705 

What's your meaning of "manually flipped all the headers to the bottom of the board", I have tried to flip/rotate the device in both 2D and 3D but seems these are not the same operation as you did. Would you please record a video that contains steps to reproduce from scratch to help us understand the status?

Thanks!

[hex705]

Hi @yiqiu.han ,

thanks agin for the help.  Screen cast crashes on my mac and adding a vimeo link breaks the interface for adding video -- quality stuff team. 

so here a link to the issue :

https://vimeo.com/508430793

s

s

[yiqiu.han]

Hi, @hex705 

Sorry for the late response. I have reached to the development team and talked about this behavior.

The reason it behaves like this is that "Mirror‘ a device in 3DPCB environment is not really mirroring the device, "mirror" a solid in general 3D design would create a new solid if the original one is not symmetric.

The angle of a device after mirroring behaves the same way inside 2D PCB, you would see the same behavior when mirroring a device in 2D PCB.

Hope that helps~

-Yiqiu