Fusion 360 Simulation - Thermal. Electronics passive cooling in sealed enclosure

[krokocad]

Is Fusion 360 capable of thermal simulation for sealed electronics enclosure?

+ There is one heat source, known wattage
+ Heat source placed into sealed case
+ Case walls has known material
+ Outside-of-case environment temp to solve for is known.

For full analysis one should need convection, conduction, radiation and conjugate heat transfer (buoyancy).

It could be simplified by using only convection and conduction (although radiation in natural convection gives quite a lot) giving sim model having 3 thermal resistances

<-> T(source)
<-> R_convection(air inside enclosure)
<-> T(enclosure inner wall)
<-> R_conduction(enclosure wall)
<-> T(enclosure outer wall)
<-> R_convection(ambient air)
<-> T(ambient)

I took a look at "PCB Design Thermal Analysis" video which is on Autodesk official channel https://www.youtube.com/watch?v=Xe3Fo4_hrUM
At 31:30 actual end product is shown with case, but the video never solves for it. 40:35 the presenter sets up the convection as if PCB board is placed directly in atmosphere (infinite thermal mass) having 25C. Well, maybe that was just a simplification as the presenter assumes that the case in video has so many holes that for practical purposes sim can be set up in the way it was done. Or maybe it was just done that way because Fusion is incapable of simulating the setup with enclosure?

I am attaching a super simple sample model that consists of 100x100mm FR4, that has 50x50 discrete component on it (source), that has dummy aluminium heatblock on it, everything enclosed in ABS case.

It has one simulation set up, where enclosure was removed in "Simplify" stage.
If the matter in question is possible, how would one set up such sim in F360?
If the matter in question is not possible, how does it correlate with what is F360 meant (as my understanding goes:)) for. I mean, take for example the sample video, it shows that F360 was used to create "everything around the electronics" (MCAD), not PCB (ECAD), IMHO it would be quite natural to assume that F360 exactly CAN solve the issue in question - validate enclosure design; otherwise F360 thermal sim is just an extension for Eagle to validate PCBs with components placed in atmosphere.

Other references: "Approach B" as discussed in this SimScale webinar. https://youtu.be/zbG9Dfy49Js?t=1978

Thanks in advance!

[krokocad]

Tried a hack.

Filled enclosure with a body; for that I booleaned out all other stuff that is inside enclosure; set material for the body to air.
Set in simulation everything to conduction (thus nothing to set :), just run automatic contacts), except for enclosure outer faces (set convection) and heat source (set to internal heat).

There is something on the screen, attached screenshots.
Enclosure actually heats up.

Max temperature is higher than when enclosure is off, which is expected, but the result (1356 C) seems... anyways, any comments on the original question? Probably only the ones with knowledge of inner workings of sim engine and F360 relation to it can answer this, my hack might just be abusive and result is totally false.

enclosure disabledenclosure hack with filling air body

[dustymiller64]

I am in exactly the same position, IP67 enclosure with internal heat sources. When setting the ambient, is this inside or outside the enclosure, I would assume outside but I don't see any thermal air temperatures outside in the results!

Did you find any other clarity on this type of enclosure study?

[krokocad]

Contacted support and they added me to testers for their "Electronics Cooling" module, logged out/in Fusion app, opted in for "Electronics Cooling" under Preferences : Preview features, set up testing stuff, clicked simulate, waited (this sim type executes on their servers and really takes some time) and voala.