Two suggestions: simple tented vias and allowing equations to set x,y position

[Anonymous]

I know it is possible to place tented vias by changing the mask stop setting under DRC, but it still doesn't give convenient control of individual vias. It would be nice to have a simple check box in the properties of a via.

Additionally it would be nice to be able to enter a simple equation when setting the x,y position. For example: (0.125 + 0.5), or (0.125 + 5*0.5), etc. This would make creating footprints more convenient since manufacturers typically provide relative distances between pads.

Thanks

[jorge_garcia · Accepted solution]

Hi @Anonymous,

I hope you're doing well. Both of these are already on the todo list, thanks for the bump.

Please let me know if there's anything else I can do for you.

Best Regards,

[Anonymous]

I want to second the request for tented vias.  We recently sent a board to a board house with a BGA with 50 mil pin spacing and a lot of microvias between the pins.  We wanted to tent these so make sure that during the BGA placement they are not exposed to create accidental and unwanted connections.  We had to pay an extra $250 in NRE for the board house to tent these vias since we could not do it in Eagle.

The original post here states that you can change the design rules, but the only way that works is using the drill diameter limit so there is little precision in which holes are or are not tented.

[Anonymous]

Good to hear that.

Then I'm curious when we can make simple equation on input field?

Could you estimate a schedule approximately? such as version.

It's inconvenience because I have to open calculate every time for simple equations.

I really hope using arithmetic operator for value.

Best regards

[jorge_garcia]

Hi @Anonymous,

I hope you're doing well. If I give a schedule, you're going to hold me to it 🙂

It's on the todo list like I mentioned earlier but it currently doesn't have a very high priority so it' not in the schedule for implementation as of right now.

With that said we see the value in this feature so it will make it into EAGLE at some point.

Please let me know if there's anything else I can do for you.

Best Regards,

[Anonymous]

you're right 🙂

Thanks for answer me.

[ajarizaleta]

Hi Jorge, some thoughts about.

As I see the PCB rendered in Fusion 360, it looks like the vias are exposed (see png below). As the definition of Tenting (on https://www.mclpcb.com/pcb-tenting/), the vias on Eagle are for default not Tented.  In this same token, this means that vias has no Solder Mask over them.

In my case, I need to use both sides of PCB as Copper Foli Heat Sinks, as a Solder Pad QFN or similar is used. In this case, It's recommended to fill the vias with solder (https://www.cree.com/led-components/media/documents/XLamp_PCB_Thermal.pdf). This increases thermal conductivity by 60%. Hence, it will be important to me to know or how to control how the vias are set up. For this increase to happen, the vias have to be small enough (Cree paper mentions 0.6mm vias) to be filled with solder. They even recommend copper filled vias. (they measured on 1-oz copper plating, 64 °C/W unfilled, 42 °C/W solder filled, SnAgCu; and 14 °C/W copper filled).

Best regards,

[jorge_garcia]

Hi @ajarizaleta,

Thanks for reaching out. EAGLE doesn't currently have a nice way to handle filled vias. So the Manufacturing preview won't show that. This is something that can be improved in the future.

Let me know if there is anything else I can do for you.

Best Regards,