Thanks for the question! I would also add to Cameron’s comments that this stack up can be an issue depending on the board house and layup. If the inner layer (between 2&3) is prepreg, this cant (generally) be drilled separately, which will mean you can’t do buried vías like this. If the top / bottom layers are impedance constrained, that can also be an issue because core thickness can be much thicker than thinner prepregs and and thus much harder to achieve reasonable trace widths. (And the use of prepreg is out when doing the top to layer 2 for blind vías.).
...Just a little food for thought. I’m sure you’re thinking about all of this (most people with the need for blind and buried vías have a solid understanding of the issues, so please don’t take offense) but worth a call to the board house if you haven’t already to confirm they can achieve what you’re after.
A nice article for Eurocircuits on layup and blind / buried vías here:
https://www.eurocircuits.com/blog/blind-and-buried-vias/Best regards,
Matt - Autodesk