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Hello everyone!
I have following questions for you:-
1) I am getting a DRC error "Blind via ratio". I have attached the layer stack up for your reference. My manufacturer says thickness to diameter ratio <=8. To remove this error what should i write in the DRC->sizes-> min blind via ratio. Currently it is set to 0.5 by default.
2) I have a very dense PCB with space constraints. I have to connect lot of smd signals from top to bottom. Can you suggest a 6 layer stack up equation (with blind, microvias and buried vias) that you have already completed successfully as HDI?
My board size :- 80x80mm
components :-700(containing 0805, 1206,2512 smd packages)
test points:- 50
Solved! Go to Solution.
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