topic material for use in cooling simulation in Fusion Electronics Forum

material for use in cooling simulation

eric_engineer — Thu, 07 Dec 2023 18:21:58 GMT

Hi, I'm working on an electronic cooling project in fusion 360. Very simple just an IC, heatsink, and maybe a fan. I can never figure out the right material to choose for the IC (which is the heat load). It's a normal plastic encapsulated package, the standard black ICs, sometimes called "Epoxy Mold Compound" Any idea what the right thing to pick here is?

Thank you.

Re: material for use in cooling simulation

jorge_garcia — Fri, 08 Dec 2023 16:21:41 GMT

Hi @eric_engineer,

I've reached out to my e-cooling colleagues and they will correct me if I'm wrong here. By default there is an generic electronic component material. This is what you should use for IC bodies.

Let me know if there's anything else I can do for you.

Best Regards,

Re: material for use in cooling simulation

eric_engineer — Fri, 08 Dec 2023 16:33:23 GMT

Okay, I think it is called "discrete component". That took a while to find, the docs and videos on this feature are kind of scattered around.

Thank you.

Re: material for use in cooling simulation

igor.krolikowski8YYUQ — Mon, 18 Dec 2023 10:30:24 GMT

The most important would be to verify the thermal conductivity material properties: model vs reality.