topic Re: Feature request: more options in package generator in Fusion Electronics Forum

Feature request: more options in package generator

robert.martinUKYP4 — Tue, 20 Apr 2021 08:05:21 GMT

The package generator is a godsend for the times I have to use it and I am generating a standard chip size and footprint. However, there are times when a specific stop layer has been defined on the datasheet and I have had to go back and manually edit the dimensions of tstop and tcream.

Would it be possible to implement a basic feature to adjust the clearance of the tstop and probably the tcream layer whilst making a package. When working with a 144 pin package and the clearance of the tstop layer is 0.07mm instead of 0.1mm, that would be a godsend.

Re: Feature request: more options in package generator

jorge_garcia — Tue, 20 Apr 2021 17:06:02 GMT

Hi @robert.martinUKYP4 ,

I hope you're doing well. Thank you for the suggestion, I'll pass it along to the team.

Let me know if there's anything else I can do for you.

Best Regards,

Re: Feature request: more options in package generator

benjamin.jordan — Sat, 24 Apr 2021 07:14:15 GMT

Hi @robert.martinUKYP4 yes there are ongoing frequent updates to the Package Generator. This is very helpful to hear form you. Some of the recent updates make it easier to customize a footprint in ways like this.

So just to be clear on this page you'd like to also see an override for solder and paste mask openings, right?:

Re: Feature request: more options in package generator

robert.martinUKYP4 — Mon, 26 Apr 2021 07:17:03 GMT

Hi Ben,

An override for solder paste and mask would be ideal