<?xml version="1.0" encoding="UTF-8"?>
<rss xmlns:content="http://purl.org/rss/1.0/modules/content/" xmlns:dc="http://purl.org/dc/elements/1.1/" xmlns:rdf="http://www.w3.org/1999/02/22-rdf-syntax-ns#" xmlns:taxo="http://purl.org/rss/1.0/modules/taxonomy/" version="2.0">
  <channel>
    <title>topic Ellectronics cooling results in Fusion Electronics Forum</title>
    <link>https://forums.autodesk.com/t5/fusion-electronics-forum/ellectronics-cooling-results/m-p/10470541#M12334</link>
    <description>&lt;P&gt;I have done some simulation on a electroics housing with a heat sink intergrated. On one side of the housing the PCBA is mounted on the outerwall on the inside.&amp;nbsp;&lt;/P&gt;&lt;P&gt;I have done 3 simulations with the same condition only with differant wall thickness where the PCBA is mounted.&amp;nbsp;&lt;/P&gt;&lt;P&gt;The results is that a thinner wallt hickness results in lower heat in the components.&lt;/P&gt;&lt;P&gt;&amp;nbsp;&lt;/P&gt;&lt;P&gt;Dimensions of the housing&lt;/P&gt;&lt;P&gt;Height = 80mm&lt;/P&gt;&lt;P&gt;Width = 250mm&lt;/P&gt;&lt;P&gt;depth = 155mm&lt;/P&gt;&lt;P&gt;&amp;nbsp;&lt;/P&gt;&lt;P&gt;My question is can I trust the results because I had aspected that the thickest wall would cool the best but in the results it is the thinner wall that performs best.&lt;/P&gt;</description>
    <pubDate>Thu, 15 Jul 2021 09:18:09 GMT</pubDate>
    <dc:creator>jaapfijn2PNX2</dc:creator>
    <dc:date>2021-07-15T09:18:09Z</dc:date>
    <item>
      <title>Ellectronics cooling results</title>
      <link>https://forums.autodesk.com/t5/fusion-electronics-forum/ellectronics-cooling-results/m-p/10470541#M12334</link>
      <description>&lt;P&gt;I have done some simulation on a electroics housing with a heat sink intergrated. On one side of the housing the PCBA is mounted on the outerwall on the inside.&amp;nbsp;&lt;/P&gt;&lt;P&gt;I have done 3 simulations with the same condition only with differant wall thickness where the PCBA is mounted.&amp;nbsp;&lt;/P&gt;&lt;P&gt;The results is that a thinner wallt hickness results in lower heat in the components.&lt;/P&gt;&lt;P&gt;&amp;nbsp;&lt;/P&gt;&lt;P&gt;Dimensions of the housing&lt;/P&gt;&lt;P&gt;Height = 80mm&lt;/P&gt;&lt;P&gt;Width = 250mm&lt;/P&gt;&lt;P&gt;depth = 155mm&lt;/P&gt;&lt;P&gt;&amp;nbsp;&lt;/P&gt;&lt;P&gt;My question is can I trust the results because I had aspected that the thickest wall would cool the best but in the results it is the thinner wall that performs best.&lt;/P&gt;</description>
      <pubDate>Thu, 15 Jul 2021 09:18:09 GMT</pubDate>
      <guid>https://forums.autodesk.com/t5/fusion-electronics-forum/ellectronics-cooling-results/m-p/10470541#M12334</guid>
      <dc:creator>jaapfijn2PNX2</dc:creator>
      <dc:date>2021-07-15T09:18:09Z</dc:date>
    </item>
  </channel>
</rss>

