topic Re: Relation between package and footprint in Fusion Electronics Forum

Relation between package and footprint

jonas.juden — Fri, 30 Jul 2021 08:49:07 GMT

Is 3D model somehow embedded in the footprint so that same footprint can't be used with different 3D models? I'm trying to figure out best practices for creating company libraries.

Currently I'm creating library for capacitors and there I would like to have different height ceramics to be associated with same footprint. As you know for example 0603 can come in different heights depending on its specifications. I would like to create different devices use same symbol and footprint for all of them and associate different package for each device.

Re: Relation between package and footprint

jorge_garcia — Fri, 30 Jul 2021 19:46:07 GMT

Hi @jonas.juden,

I hope you're doing well. In this case, you'll have to make copies of the same footprint because as it is now it only works as a 1 to 1 3d model to footprint relationship. It is possible to assign multiple 3D models to a footprint but there's isn't any mechanism to allow you select which of those to use on the 3D PCB. This is something we are working to complete the feature.

Let me know if there's anything else I can do for you.

Best Regards,