topic Re: PCB Copper Substrate With Thermoelectric Separation in EAGLE Forum

PCB Copper Substrate With Thermoelectric Separation

Coatmaster — Thu, 07 Mar 2024 10:35:36 GMT

Hello everyone

How can I design an SMD pad to be connected to the base copper metal core for thermal conductivity?

Here is an overview of what I want to achieve: https://jhdpcb.com/blog/substrate-thermoelectric-separation/

Re: PCB Copper Substrate With Thermoelectric Separation

jorge_garcia — Thu, 07 Mar 2024 23:39:53 GMT

I hope you're doing well. Achieving something like this will require good communication with your board house. You'll probably have to use a custom layer to define where those thermoelectric connections need to be and export that as it's own gerber file.

Let me know if there's anything else I can do for you.

Best Regards,

Re: PCB Copper Substrate With Thermoelectric Separation

bidrohini — Fri, 15 Mar 2024 15:14:36 GMT

You can use thermal vias between the SMD pad and the base copper metal core. These vias provide additional thermal pathways, improving heat transfer between the components. Vias play an important role in connecting different layers and conducting heat. To know more about different types of vias and their advantages, you can see this article: https://www.nextpcb.com/blog/blind-vias-and-buried-vias