Creating plated through holes with different pad shapes on the top and bottom layers

alex.rGZZ2V — Fri, 11 Jun 2021 06:57:07 GMT

I am designing a PCB that has a circular conductive pad on the top layer and a rectangular conductive pad on the bottom layer. I need these two pads to be connected with a plated through hole.

I did this by creating a new device and placing a PTH with the desired drill and an arbitrary diameter. I then drew a polygon over top of it on the top layer and the bottom layer in the shapes that I want the pads to be. Then I drew polygons of the same shapes on the tStop and bStop layers so the pads wouldn't be covered by solder mask.

This seems to work but is it the correct way of doing it? Is this ok from a manufacturing point of view? It shows up how I expect it to in the "manufacturing preview".

I've attached pictures for clarity.

Re: Creating plated through holes with different pad shapes on the top and bottom layers

jorge_garcia — Mon, 14 Jun 2021 21:51:01 GMT

Hi @alex.rGZZ2V ,

I hope you're doing well. You have indeed done it correctly, this is currently the best way to handle this situation in EAGLE so continue to do it that way.

Let me know if there's anything else I can do for you.

Best Regards,

topic Creating plated through holes with different pad shapes on the top and bottom layers in EAGLE Forum (Read-Only)

Creating plated through holes with different pad shapes on the top and bottom layers

Re: Creating plated through holes with different pad shapes on the top and bottom layers