Simulation Moldflow Hangout: Shorten your cycle time with Thermal Analysis

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Autodesk® Simulation Moldflow Hangout: Shorten your cycle time with Thermal Analysis

Webinar: Simulation Moldflow 2015: Shorten your cycle time with Thermal Analysis

Friday August 22^nd at 11:00 AM EST.

You're invited! Autodesk® Simulation Moldflow™ users are gathering for the third in a series of Hangouts designed to introduce you to the power features available in Simulation Moldflow. We'll help you make your models more accurate, efficient, dynamic, and improve the visual impact of your presentations.

This next session, Autodesk® Simulation Moldflow™ hang out we will discuss the different simulation methods used to thermally optimize your mold: Cool BEM, Cool FEM, Beam elements vs. 3D channels, Steady state vs. transient and CFD methods.

Join the session via the Web! Here's when and how:

Date & Time: Friday August 22^nd at 11:00 AM EDT

Location:  https://www1.gotomeeting.com/register/157108665
Duration: 20-30 minutes of presentation followed by Q&A

Access Information: Please register prior to the event using the above link.

Presenters

Brian Pelley – has a broad range of experiences from OEMs to global custom manufacturers. This diverse background has given Brian the unique opportunity to successfully implement simulation across a wide range of industries and applications.  Brian is a Plastics Engineer from U-mass Lowell, now based in Oregon. When he isn’t geeking out over simulation you can find him running through the old growth with his dogs and family.