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Could we have a way to monitor the junction temperature of CTM's as we run transient studies? Currently the only method is via monitor points, hopefully could have a smoother method.
![Autodesk Design & Make Report](https://forums.autodesk.com/t5/image/serverpage/image-id/1350519iCB55845EBFC43016/image-size/large?v=v2&px=999" "Autodesk Design & Make Report")