A global face splitting/imprinting option would be usefu for FEA models. This would split up surfaces automatically, facilitating specifc load, constraint, or mesh assignments downstream.
The below is not a great example but shows the concept. As it stands today, the main PCB is handled as a single surface. When the components are hidden you can see that there is no "imprint" left behind. It might be nice to be able to bring this board into simulation without all those tiny components and instead just assign heat loads to the faces where they touch the board.
You can manually split that PCB surface using the "Split Face" tool but an option to do it at a global level for all components with 1 click would be nice.
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