could you please consider the flow in very small channels or on sintered or micropillars wick where surface tension, capillarity, permeability, porosity, thin film contact, evaporation, and condensation play as vital factors. it not nice to see published papers written used FLUENT to compute what i mentioned above while i can't use CFD to do the same. a large percentage of electronics cooling application depends on phase change, where the capillarity is a vital factor. i attached a computational solution paper found most of the factors above by fluent.
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