there is a funktion called mold thermal expansion. It's disabled by default. Does anybody have more infos how this works and how big the influence is.
Does simulation gets much longer?. Are ther any paper?
I know it has been awhile since this was posted, do you still need assistance?
If so, this information can be found in the AMSI Help.
i have same doubt.. now i am using PEEK material for analyse? i want to know for this material can i consider mold thermal expansion or not?
because this material process temperature very high?
Are you running warpage? Generally speaking, mold thermal expansion does not have a huge impact on the results. Given your concern because you will be running PEEK and it does have a quite high mold temperature, you can run a fill+pack+warp as usual, then run it with the mold thermal expansion turned on. From there, you will be able to compare the warp deflection differences. Given those results, you'll be able to determine if it should be used or not.
When you run analysis with the mold thermal expansion turned on, please make sure that you select a proper mold material for your mold.
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