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As anybody used multiphysics CFD and heat transfer to simulate cooling of a hot stamp forming dies? Any details or procedure of modeling would help. Thanks.
Could you put your physical problem in more detail? Are there forced deformation on the soild bodies in the forming? How about fluid and thermal boundary conditions and initial conditions?
Jianhui Xie, Ph.D Principal Engineer MFG-Digital Simulation
we can ignore the hot stamping process steps by simply taking hot stamp blank temperature as a input and perform cooling analysis of the block where there are waterlines in the tool. The goal is see how effective is waterline layout and cooling. If you are familiar with molding, this would be similar to cooling of the mold once the part area is filled with plastics.
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